11 Sept 2024, Wednesday | 14:55 - 16:20 Hrs
Advanced Packaging & Heterogeneous Integration - India's Roadmap to the Next Frontier
Synopsis:
The session on Advanced Packaging and Heterogeneous Integration at SEMICON India will explore how these technologies are addressing the challenges of Moore's Law slowdown and driving innovation in chip design. Experts will discuss how advanced packaging techniques like 2.5D and 3D integration enable the combination of chiplets optimized for different functions, leading to enhanced performance, lower power consumption, and reduced costs.
The session will also highlight the role of heterogeneous integration in enabling the development of next-generation devices for artificial intelligence, high-performance computing, and other demanding applications.
Conference Sponsors
Program Outline
| Time | Program |
| 14:55 - 15:00 | Welcome Remarks by Session Chair Mark da Silva, Ph.D., Sr. Director, Smart Manufacturing Initiative - SEMI Smart Manufacturing / Advanced Packaging & Heterogeneous Integration (APHI) Community, SEMI |
| 15:00 - 15:15 | Process Control Challenges for Advanced Packaging Dr. Lena Nicolaides, Vice president and General Manager of Patterned Wafer Inspection Products, KLA |
| 15:15 - 15:30 | The Fourth Industrial Revolution (4IR) and Its Impacts Maitreyee Mahajani , SVP Fab Operations, Western Digital |
| 15:30 - 15:45 | Materials Engineering Innovations to Address Next-Generation Electronics Packaging Challenges Dr. Sundar Ramamurthy, Group Vice President, General Manager, Epitaxy, Packaging and ICAPS, Semiconductor Products Group, Applied Materials, Inc. |
| 15:45 - 16:00 | Global Trends and Challenges in Semiconductor Packaging Dr. Pavel Seroglazov, Manager of Strategic Partnerships, BESI |
| 16:00 - 16:15 | Dr Raja Swaminathan, CVP of Packaging, AMD |
| 16:15 - 16:20 | Closing Remarks by Session Chair Mark da Silva, Ph.D., Sr. Director, Smart Manufacturing Initiative - SEMI Smart Manufacturing / Advanced Packaging & Heterogeneous Integration (APHI) Community, SEMI |