Dr. Sundar Ramamurthy

Dr Sundar Ramamurthy is responsible for Applied’s business in wafer level packaging, specialty semiconductors and epitaxy markets. He leads an integrated, cross company team to fuel growth in some of the fastest growing markets in the semiconductor industry.

Over the past two decades, Dr Ramamurthy and his team have delivered profitable growth for the corporation in multiple areas of semiconductor equipment technologies rapid thermal processing, plasma doping, physical vapor deposition, atomic layer and chemical vapor deposition of thin metal films. He led teams that commercialized 20 new products to solve critical transistor and interconnect scaling challenges by introducing new materials and interface engineering solutions into volume manufacturing.

Dr Ramamurthy joined Applied as a new college graduate in 1996. He holds a PhD in materials science and engineering from the University of Minnesota and a bachelor of technology degree in metallurgical engineering from the Institute of Technology, Banaras Hindu University

Presentation Title

Materials Engineering Innovations to Address Next-Generation Electronics Packaging Challenges

Abstract

Heterogeneous design and integration, which has been called the fourth stage in the evolution of Moore's Law, allows us to extend performance and cost improvements by separating functionality across two or more chiplets interconnected by high bandwidth and power efficient interconnects, delivering comparable power and cost efficiencies to a monolithic integrated circuit. Advanced packaging technologies enable integration of different components to build System in Package (SiP) devices. Chiplet integration enables larger body size packages, extending beyond the standard lithography reticle field.

Equipment based on the dry process technologies used in wafer processing delivers fine line patterning for high density inter connections. Large form factor panel level processing enables larger packages with higher manufacturing productivity at low cost. With its broad portfolio of semiconductor and display fabrication technologies and products, Applied Materials is addressing the challenge of delivering Front End manufacturing capability at Back End cost requirements.

This presentation will also highlight how Applied is leading the collaboration across the ecosystem, solving customer roadmap challenges, and enabling a faster cycle time to commercialization.