Dr. Lena Nicolaides

Dr. Lena Nicolaides is vice president and general manager of patterned wafer inspection products at KLA. Lena drives product development, customer relationships, and technology collaborations across a range of wafer inspection applications including leading-edge foundry, logic and memory, automotive, and advanced packaging. Previously, Lena held various technology and business leadership positions at KLA including general manager of the macro inspection, sensor-wafer, and implant metrology divisions where she led high-performing teams to achieve profitable growth, develop new applications, and penetrate adjacent markets. Earlier, Lena served as the company’s chief technology supply executive where she was responsible for strategic supplier collaborations. Throughout her career at KLA, Lena has optimized global organizations and drove technology differentiation in new markets. Prior to joining KLA, she held senior marketing and engineering roles at Therma-Wave. 

Lena received her master’s and doctorate in mechanical engineering in the field of photothermal and photoacoustic science from the University of Toronto. She has numerous patents in semiconductor and related fields. Lena currently serves on the board of Veeco Inc and is an active mentor for young professionals in the areas of management and leadership.

Presentation Title

Process Control Challenges for Advanced Packaging

Abstract

Advanced packaging of leading-edge logic and memory semiconductors is playing a critical role in AI. Through the integration of multiple semiconductor devices and the efficient management of power, heat, and data, 2.5D and 3D packaging provides high performance and functionality required in AI applications. However, the increasing complexity of advanced packaging processes presents significant challenges in terms of development time and production yield. Advanced inspection and metrology at the wafer level are critical in addressing these challenges, enabling monitoring and control of these processes in production to accelerate yield and improve quality. In essence, advanced packaging and its process control are key enablers of the continued advancement of AI semiconductor solutions.