Dr. Pavel Seroglazov

Dr. Pavel Seroglazov is the Manager of Strategic Partnerships at BESI. With a Bachelor's degree in Semiconductor Physics, a Master's in Quantum Optics, and a diploma from Eindhoven Technical University, Pavel brings over eleven years of experience in the semiconductor field.

His career began at ASML General Research, where he worked on EUV source optimization for lithography. In 2015, he joined ISTEQ B.V., driving plasma light source system development for wafer metrology applications. Since 2021, Pavel joined BESI's CTO office, fostering strategic partnerships with industry leaders and research institutions, with a strong emphasis on advanced packaging and submicron Die attach technologies.

Presentation Title

Global Trends and Challenges in Semiconductor Packaging

Abstract

The semiconductor industry is driven by rapid technological advancements and an ever-growing demand for high-performance, compact, and efficient electronic devices. This session, "Semiconductor Packaging - India's Roadmap to the Next Frontier," will explore global trends and challenges in semiconductor packaging, focusing on how India can position itself in this critical field.

In my keynote address, I will highlight key global trends in semiconductor packaging, emphasizing the industry's shift towards advanced technologies such as 2.5D/3D integration, Fan-Out Wafer-Level Packaging (FOWLP), and heterogeneous integration. These advancements are essential for the next generation of AI, 5G, and IoT applications, driving performance and efficiency improvements.

India, with its growing semiconductor ecosystem, is poised to play a significant role in this global landscape. Initiatives like "Make in India" and "Digital India" are laying the groundwork for robust growth in the semiconductor sector. A key strategy for India is to build a solid foundation on mainstream, high-volume packaging technologies. This approach will provide the necessary scale and experience to transition to more advanced packaging technologies in the future. Starting with mainstream technologies will enable India to develop the infrastructure and expertise required for more complex packaging solutions.

As a leading provider of semiconductor packaging equipment, BESI is committed to supporting India’s ambitions in the semiconductor domain. BESI’s state-of-the-art technologies in Die attach, advanced packaging, and plating are critical enablers for achieving the precision, efficiency, and scalability required by modern semiconductor applications. By leveraging BESI's expertise and innovative technologies, India can establish itself as a key player in the semiconductor industry, ready to embrace the future of advanced packaging.