Gokul Kumar

Dr Gokul is a Senior Director at Micron Technology. He is a highly qualified technologist with over ten years’ R&D experience in semiconductor packaging. Consistent Track Record of High-profile leadership and technical successes in areas of Advanced Package Design, System integration, Substrates, Technology Development, and 3-D Technology.
Dr. Gokul demonstrated innovation at highest levels of Global Research, Leadership, and Innovation (500+ Citations, 8 Patents, 16 International Publications, Invited Talks). He has in-depth understanding of product/package specs & fitment requirements across multiple product segments.

Presentation Title

Unleashing Power of Advanced Packaging with Smart Manufacturing

Abstract

In this keynote address, we explore how Micron’s “Pioneer” ATMP India facility is at the forefront of the global semiconductor industry’s next evolution.

With it’s cutting-edge “Future Factory”, smart manufacturing techniques enable vertical integration of Silicon Dies into highly optimized system modules. We examine foundational concepts from heterogeneous integration, Electronic Design Automation & Digital twins as it applies to manufacturing. These advanced controls are critical for maintaining high quality and consistency, enabling predictive maintenance, and optimizing production processes. Attendees will gain insights into how Micron is leading this global advancement by combining multidisciplinary building blocks to create industry 4.0 in semiconductor package manufacturing.