Package Manufacturing Bootcamp by Micron

Package Manufacturing Bootcamp - by Micron

Duration: 2 Hrs
Course Type: In person at SEMICON India
Instructor: Dr. Gokul Kumar

Dr. Gokul Kumar is the Senior Director of Package Development at Micron Technology. With over ten years of R&D and product design leadership expertise in semiconductor packaging, Dr. Gokul has a consistent track record of technical successes in areas such as Advanced Package Design, System Integration, Substrates, Technology Development, and 3-D Technology. He holds doctoral degree in Electrical & Computer Engineering from the Georgia Institute of Technology with over 20 international publications, received 10 patents, and delivered numerous invited talks.

Session Description:

SYSTEM IN PACKAGE FUNDAMENTALS

Types of semiconductor packages & requirements, Package and Product Roadmap for Advanced Memory and AI/ML applications, High Bandwidth Memories, New Product Introduction (NPI) business process, Electronic Design Automation (EDA) for packages, Advanced Codesign & Simulation techniques for future System optimization

PACKAGE MANUFACTURING PROCESSES

Packaging Assembly Technology, Wafer Thinning, Dicing, Die Attach, Wire bonding, Flip Chip process, Flux Cleaning, Underfill, Encapsulation, Laser Marking, Solder Ball Attach, Reflow, Singulation, IC Packaging Toolsets & equipment operation, clean room operations.

SEMICONDUCTOR PACKAGE MATERIALS AND QUALIFICATION

Reliability testing & qualification- MST/MSL, TC/TS, HAST & uHAST, Mold Compounds (Moldability), Underfill Materials, Die Attach Adhesives & Films, Substrate Technology, Bonding Wire, Solder & Dielectric materials.